WHITE PAPER - An ECA with Bottom Line Benefits
By Mark Currie, Ph.D., Henkel Electronic Materials LLC
Jun 04, 2012
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The benefits of ECAs are many. Among the advantages are lower temperature processability, enabling both bare die and passive component mounting in a single step; lower stress assemblies, as the ECAs compensate for the thermal mismatch between components and their corresponding substrates; and lead-free formulations that comply with current industry regulatory standards. Until now, one of the few disadvantages to ECAs has been their inability to cope with non-noble metals on component terminations, which meant they could be used primarily with higher cost components finished with palladium silver, silver or gold. But, thanks to the materials experts at Henkel, that's no longer the case.
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