WHITE PAPER - Automotive Materials from Bumper to Bumper
By Geert Luyckx, Henkel Electronic Materials LLC
Jun 04, 2012
With the electronics content of modern automobiles increasing substantially over the last decade, the materials used to facilitate device interconnection, protection and thermal control have also transformed to address next‐generation requirements. Obviously, the location of the electronic device within the vehicle drives the materials requirements. But, there is not a single class of products for many applications, and there may be numerous materials approaches to achieve certain performance and/or cost objectives. Materials specialists that offer know‐how in
multiple formulation techniques - for example, being able to marry adhesive performance with thermal control in a hybrid material - are providing superior value to automotive manufacturers as they consider next‐generation designs.
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