MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at the SMTA Upper Midwest Expo and Tech Forum
Jun 01, 2012
MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA Upper Midwest Expo & Tech Forum, scheduled to place June 7, 2012 from 10 a.m.-3 p.m. at the Hilton Minneapolis/Bloomington Hotel in Bloomington, MN.
The MINIOVEN 04 provides a reflow environment in a compact,
stand-alone unit and is ideal for pre-bumping QFNs and reballing BGAs and CSPs. The efficient hot gas circulation ensures optimal heating of the component and a controlled reflow process. The unit offers programmable modes and accommodates up to 99 profiles, with the ability to edit individual profiles and fine-tune parameters.
A gas connection is available for processing gases, such as nitrogen, argon and formic.