TSMC and UMC Will Invest NT$200 B. in Southern Science Park
Mar 15, 2012
In anticipation of the upturn of the global semiconductor market, Taiwan Semiconductor Manufacturing Co. (TSMC) and United Microelectronics Corp. (UMC), the world's top two contract IC makers, will break ground on expansion projects in South Taiwan Science Park in April.
Chen Chun-wei, director general of the park administration, confirmed yesterday (March 13) that the fifth-phase project of TSMC's 14th plant will break ground on April 9, while the fifth-phase project of UMC's 12th plant will break ground on April 11. As a result, IC contract manufacturing will replace optoelectronics, including FPD (flat panel display) and solar energy, as the park's largest industry.
An official of the Southern Taiwan Science Park Administration revealed that TSMC has actually kicked off land preparation work for the fifth-phase project of the 14th plant this month; the project is the largest expansion project of the company, after its 15th plant in Central Taiwan Science Park whose construction was kicked off last year.
Industrial insiders estimated that a 12-inch wafer fab will cost at least NT$100 billion for construction, including factory building, equipment, and other facilities. As a result, TSMC and UMC will invest over NT$200 billion in Central Taiwan Science Park in the next two years.
The expansion projects of the two companies will create 2,000 job vacancies each and a 12-inch wafer fab will generate NT$40-50 billion of production value annually. Chen Chun-wei pointed out that the semiconductor industry, mainly IC contract manufacturing, will account for 45% of the total output value of Southern Taiwan Science Park in 2012, which is projected to grow 10.5% to NT$630 billion. Both TSMC and UMC have expressed plans to further construct new fabs in the park in the long term, according to Chen.
source & copyright: CENS