SelectConnect Technologies launches LPKF MID Service

Chicago based SelectConnect Technologies, a division of Arlington Plating Company has recently commenced a new manufacturing service business for producing molded interconnect devices (MIDs) using LPKF Laser & Electronics' Laser Direct Structuring (LDS) technology.

"SelectConnect Technologies broad experience with both plating and MID components makes them an ideal candidate to offer the LDS technology to a number of industries in North America." noted Stephan Schmidt, President LPKF Laser & Electronics.

MIDs are molded plastic components that are laser activated and then selectively metalized with copper, nickel, and gold. The components are true 3D devices, merging the features of circuit carriers and housing together in one part. This technology is commonly used for cell phone antennas, and for interconnect solutions in the automotive and medical industry.

To learn more about the LPKF's MID technology and contact information for SelectConnect Technologies visit: www.lpkfusa.com/mid.