WHITE PAPER - Precise Solder Dispensing in High-throughput Microdevice Packaging Applications
By Hanzhuang Liang, Linh Rolland, Floriana Suriawidjaja, Mani Ahmadi and Heakyoung Park, Nordson Asymtek
Feb 05, 2015
A high precision, high throughput solder paste dispensing process fills the gap between novel packaging design, traditional stencil printing and low throughput design.
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