WHITE PAPER - Voiding and Reliability of BGA Assemblies with SAC and BiSnAg Alloys
By Ning-Cheng Lee, Yan Liu, Joanna Keck, and Erin Page
Apr 07, 2014
Low melting 57Bi/42Sn/1Ag (BiSnAg) was explored for replacing SAC solders as a low-cost solution. In this study, BGAs with SAC105, SAC305, and BiSnAg balls were assembled with SAC105, SAC305, or 57Bi/42Sn/1Ag solder paste.
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