High-Reliability Meets Pb-free and Halogen-Free The Ultimate Solder Material Trifecta
By Ian Wilding and Gavin Jackson The Electronics Group of Henkel
Oct 24, 2013
While traditional SnAgCu (SAC) halide-free solder materials are suitable for many electronics assembly applications, some market sectors are having challenges incorporating these materials into devices and systems that will be subjected to harsh operating environments. In particular, automotive products that will experience high operating temperatures, increased thermal cycling conditions, high vibration and moisture or liquid contact are not compatible with previous-generation Pb-free, halide-free solder materials.
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Consider that in some automotive 'under the hood' applications, temperatures can cycle lower than -20°C and can also exceed 125°C and one can understand the reliability required to survive such dynamic temperature swings. These temperature extremes are often too much for standard SAC solders to manage, necessitating the need for a higher-reliability Pb-free alloy capable of coping with these conditions. But, it's not just the integrity of the lead-free alloy that can impact solder reliability. No-clean post reflow residues can also affect reliability, as they can interact with other surface materials and potentially cause corrosion or lower insulation resistance.
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