UTAC running volume device test production on Teradyne UltraFLEX
Aug 24, 2005
High performance test system extends FLEX Platform family
Teradyne, Inc. (NYSE:TER) announced UTAC (United Test and Assembly Center, Ltd), an independent provider of total semiconductor test and assembly solutions, has deployed the Teradyne® UltraFLEX(TM) test system from the FLEX(TM) Test Platform and is currently running multiple systems in volume production. UltraFLEX systems were shipped to UTAC's facility in Singapore for testing mobile communications, broadband and network devices at both probe and final test. UTAC configured the systems with high performance serial bus test capability to over 6 Gbps (to cover the latest industry standards like PCI Express I and II and SATA) and broadband test instrumentation with bandwidth to 150 MHz and 140 dB dynamic range (to cover the most demanding applications, including HDTV and STB). UTAC has been a Teradyne customer since 1999 and currently has over 80 Teradyne test systems installed.
The UltraFLEX system incorporates all the features of the FLEX Platform architecture to achieve higher test efficiency and optimum test economics. UltraFLEX high-density instrumentation provides the digital speed, pin count, and precision measurement for multi-site testing of next-generation, high performance devices. The system's low-jitter design reduces guard-band requirements, which means customers can achieve higher yields. Better noise performance means fewer samples are needed during testing, resulting in higher throughput.
"The Teradyne FLEX Platform provides a cost competitive testing edge for the broadband communication market that UTAC is serving," said CK Tan, Group Vice President of Corporate Test Development, UTAC. "With our base of FLEX Platform systems, we now have the unique capability to support customers in every phase of the semiconductor SOC life cycle, from engineering development to volume production for datacom, broadband, graphics, and computing devices."