Taconic announces the launch of low loss bromine-free prepregs and laminates
Aug 26, 2005
Taconic announces the expansion of the TacPreg®/TacLam family of products by offering low loss bromine-free prepregs and laminates. The new family of "green" materials, TLG-2.9 & 3.0, was designed with lower dissipation factor (df = 0.0030 to 0.0038 at 10 GHz - thickness dependant). The TLG family of products was designed for the military, RF, and high speed digital markets, where a homogeneous dielectric constant throughout the laminate is desirable.
"TLG-2.9 & 3.0 reduce the need for thermoplastic films in the military markets, provide the digital market with homogenous products reducing skew in high speed data transmission, and offer the RF marketplace a material set that can be foil laminated when designing low loss/low cost multilayers. We are excited that we were able to improve the product line to benefit each of these markets while at the same time become WEEE & RoHS compliant by removing any source of bromine," said Thomas F. McCarthy, Director of Engineering and Product Manager for the TacPreg®/TacLam family of products.
TLG-29 & 30 were designed and beta tested on thick backpanels with the intent to improve the ease of fabrication in difficult designs.
TACONIC manufactures TacLam®, ORCER, and TacPreg® substrate materials for microwave frequency and high-speed digital applications. The product offerings range in dielectric constants from 2.17 to 10. Laminate lengths up to 106" (2.7m) are supplied. For more information, please contact: In the USA: Dr. Thomas McCarthy at Taconic, NY: +518-658-3202, email: firstname.lastname@example.org; in Asia: Mr. Lim at Korea Taconic Co., P: +82-31-704-1858, email: email@example.com; and in Europe: Mr. Manfred Huschka at Taconic International, LTD, Ireland, P: +353-44-34080, email: firstname.lastname@example.org, or visit us on the web at www.taconic-add.com.