V.J. Electronix to highlight Summit 1800 Rework Station at NEPCON South China
Aug 29, 2005
V.J. Electronix Inc., together with Kasion Automation Ltd., have announced that they will highlight Summit 1800, a new advanced rework system in booth 2D01A at the upcoming NEPCON South China/EMT South China.
V.J. Electronix's Summit 1800 Rework system provides some of the most advanced features designed specifically to address the most difficult rework challenges, including lead-free rework for large components.
An increased 65-mm alignment field of view with digital and optical zoom and split image ensure precise placement of large packages, sockets and connectors. The addition of programmable, motor-controlled top heater positioning in conjunction with the Summit's independent pick-up motion provides the ultimate in process flexibility.
V.J. Electronix's Windows-based SierraMate 7.0 software improves on the Summit's industry-proven simple operation and process control. New Advanced Auto Profile with rules-based process development allow process engineers to set specific constraints to be applied during automatic profile generation. This is a significant benefit for lead-free processes.
With standard board handling of 455 x 560mm, placement accuracy of 12 to 25 microns and magnification capability from 2 to 40X, the Summit 1800 offers users numerous benefits, including advanced thermal data collection and analysis with trend capability, password-protected user accounts, and positive flow control for peak temperature protection of delicate components. Additionally, the system can rework the following applications: MCM, BGA, QFP, CPU sockets, vertical connectors, straddle mount connectors, passive components, microSMD, flip chip, microBGA and CSP.
Various options are available for the Summit 1800, which include manual scavenger, component print station, cooling boost, sliding board support, 17" LCD monitor and 22 x 30" board size upgrade.