ESSEMTEC highlights RO400FC reflow oven at Assembly Technology Expo
Jul 01, 2005
ESSEMTEC has announced that it will display RO400FC, a full convection reflow oven for small to mid-size volume productions, in the EASI line again this year at the upcoming Assembly Technology Expo.
Soldering complex SMD boards and new package technologies requires a well-controlled soldering process. RO400FC uses only full convection to heat PCBs homogeneously. The convection technology uses vertical laminar flow, which offers an efficient heat transfer with the lowest delta T values. This technology makes the oven perfect for lead-free solders.
Zone temperatures - three preheat and one peak - are fully programmable, as is the closed-loop-controlled conveyor speed. Zone temperatures are measured within the airflow at the board height to guarantee highly reproducible soldering conditions.
The universal mesh belt or the optional precise chain conveyor transports single- or double-sided boards up to 400 mm width. Other benefits include a full convection oven for even temperature distribution, high air volume for low thermal stress of components, vertical laminar flow for efficient heat transfer, closed-loop conveyor drive system for controlled speed, easy profile selection and an optional flying thermocouple for temperature profiling.
RO400FC is for standard or lead-free soldering, features an integrated microprocessor control or computer control option, an optional SMEMA interface, ESSEMTEC RO-SOFT profiling software, and built-in security switches.