MVP to showcase wirebond and die placement inspection capabilities at SEMICON West
Jul 08, 2005
Machine Vision Products (MVP) announces that it will introduce the successful addition of wirebond and die placement inspection to its Supra Autoinspector in booth 8650 at the SEMICON West trade show and exhibition, scheduled to take place July 12-14, 2005 in San Francisco, CA.
MVP is expanding its current capabilities to include the application of wirebond and die placement. "We are very excited to offer this new affordable option with our Supra AOI system to the wirebond and die placement inspection by leveraging the same capabilities and tools offered by our standard MVP AOI software," states Dr. George Ayoub, President and CEO of MVP. "This will expand our product line beyond component assembly and paste inspection, enabling MVP to offer a competitive product for the packaging industry."
Defects such as wire trace conformity, bent wires, distance to adjacent wires, loop height, straightness tolerance, ball/wedge geometry, and contamination can easily be detected with the Supra wirebond configuration. Die Placement inspection uses the same flexible platform to determine placement and rotation accuracy of the die to the substrate.