Milara receives industry award for printer system
Jul 15, 2005
Milara Inc. has announced that it has been awarded an Advanced Packaging Award in the category of Wafer-level Packaging for its STW-1 Wafer Printer System.
The crystal glass award was presented by Advanced Packaging Magazine's Editor-in-Chief Gail Flower to President Krassy Petkov during a Wednesday, July 13, 2005 ceremony that took place at the Regency Center in San Francisco, CA.
Milara takes its combined system technology practice one step further with the development of the SemiTouch Wafer Printer system (STW-1). The system is capable of both wafer stencil printing and bumping within a single system. The STW-1 is molded after Milara's standard SemiTouch printer but offers significant advantages. One important advantage is that by pressing a single button, the system converts itself from a wafer bumper to stencil printer in seconds. This saves time because there is no changeover and the operator has incredible ease of use for this process. No down time means significant cost reductions on the line.
Capable of printing 300 mm wafers, and environmentally friendly, the STW-1 uses less paste than standard systems and there is significantly less waste build-up. No other competitor uses this patented technology, making this is an important improvement in the printing marketplace.