Hover-Davis receives two industry awards

Hover-Davis Inc. has announced that it has been awarded an Advanced Packaging Award in the categories of Die Attach Equipment and Materials, and Handling Equipment/Fixtures for its latest addition to its Direct Die Feeding product line - the DDf Ultra.

The award was presented by Advanced Packaging Magazine's Editor-in-Chief Gail Flower to Corey Davis, DDf product manager, during a Wednesday, July 13, 2005 ceremony that took place at the Regency Center in San Francisco, CA.

The DDf Ultra's innovative design makes it capable of feeding a wide range of bare die and flip chips with high throughput, and can be mounted on almost every placement machine, making it a cost-effective as well as innovative feeder.

As a complement to the DDf, which has been an industry leading die feeding solution for the past four years, the performance of DDf Ultra is optimized around the handling of small flip chips. Upon release, the DDf Ultra is capable of feeding die down to 0.5 mm sq. with a throughput exceeding 6,000 die/hour - with smaller die sizes and higher throughputs planned. These options improve speed and throughput drastically, and will continue to do so as the system evolves.

Recently, the company has seen a rapid expansion in the number of applications requiring volume assembly of die below 1 mm sq., driven by RFID and LED technologies. These potential customers require very low assembly costs and have very high volumes. By combining the company's DDf Ultra with a state-of-the-art SMT chip shooter, Hover-Davis can create a "die shooter" or "flip chip shooter," which is essentially new class of die assembly solution. The company believes these solutions have the capability of offering customers unprecedented reductions in assembly cost, which in turn will aid in the proliferation of new products and technologies.