Lead-Free Cleaning Study Results Published in Kester's Lead-Free Connection
Jul 19, 2005
A recent study by ZESTRON has indicated that no cleaning-related issues will be expected during the transition to lead-free formulations. However, lead-free alternatives will increase the importance of cleaning applications.
"Assuming the user runs modern cleaning agent technologies, it should be possible to easily remove flux residues from any lead-free paste," said Umut Tosun, Application Technology Manager for ZESTRON America. "It should be pointed out that lead-free alloys frequently contain silver. Silver is prone to forming hydroxides and sulfides - thus causing an increase in electrochemical migration. Therefore we foresee an increased demand for cleaning."
Results were based on a study of approximately 50 lead-free solder pastes. Complete ZESTRON test results were recently published in "Lead-Free Connection," Kester's quarterly newsletter. "Lead-Free Connection" provides industry professionals with the latest lead-free technological information.