Henkel relocates mold compound capabilities to Irvine facility
Jul 22, 2005
Henkel has announced the relocation of its mold compound development, application engineering and technical service capabilities from Olean, NY to its new Irvine facility.
"We know of no other materials company that has such a broad range of materials offerings and the ability to provide tested, compatible material sets for semiconductor packaging and PCB assembly applications," says Dr. Larry Crane, Global Director of Research, Development & Engineering.
"With the unification of product development in one facility, Henkel now has the capability to develop our mold compounds, die attach products, thermal interface materials, underfills and encapsulants under one roof with a superior technical team. This streamlined approach is a win-win for everyone, especially customers who can prototype new packages more quickly, accelerate time-to-market and do so more cost-effectively."
The 53, 000 square foot, next-generation facility is host to a state-of-the art analytical and failure analysis lab and a 5,000 square foot Class 10,000 clean room which houses some of the most advanced testing and manufacturing equipment available on the market today. In addition, the operation boasts a 2,000 square foot surface mount production line with screen printing, reflow and dispensing capabilities which will enable the applications team to evaluate various surface mount assemblies, including Pb-free, 0201s and chip-on-board.
For more information log onto www.electronics.henkel.com.