IPC sponsors seminar on emerging miniaturization technologies

Smaller, thinner, lighter.  Anyone involved in creating or assembling printed circuit boards (PCBs) knows that these words have become the mantra of the electronics industry. However, this demand is becoming a daunting challenge. How can manufacturers meet the requirements the industry is calling for?

A one-day seminar on September 22, 2005, sponsored by the IPC PCB Suppliers Council Steering Committee and hosted by Motorola will bring the supply chain together to trade information on manufacturing the ever shrinking circuit board.

Attendees will begin their day with a keynote address, "Smaller, Faster, Cheaper: You Can Do the Impossible," by Iwona Turlik, Motorola's Advanced Technology Center vice president and director. Dr. Turlik will explore the achievements made in miniaturization technologies and give an overview of where the industry is headed.

Then, representatives from the EMS (electronics manufacturing services), OEM (original equipment manufacturer) and semiconductor industries will discuss emerging miniaturization technologies from their point of view, including roadmap requirements.

"PCB miniaturization is a trend that will continue to revolutionize our industry," says David Rund, chairman of the New Technology Subcommittee of IPC PCB Suppliers Council Steering Committee and president, Taiyo America Inc. "Seminar attendees will get a rare opportunity to hear the supply chain share its goals and challenges as they pertain to miniaturization technologies. They'll also be able to identify opportunities within their own technology roadmaps for future product development."

For additional information on "Emerging Miniaturization Technologies: An Industry Interchange," visit www.ipc.org/calendar or contact Susan Filz, IPC industry programs manager at 847-597-2884 or SusanFilz@ipc.org.