New PEF stencils from Tecan

UK based Tecan has announced that using leading-edge photo-electroforming (PEF) techniques has allowed them to produce stencils for the most demanding high-volume multi-component PCB production requirements - ensuring optimum paste release from a single squeegee pass. The PEF stencils are produced in nickel, which inherently has a lubricational quality, further enhancing paste release. The manufacturing technique is being increasingly recognised as the optimum and most cost-effective method of producing such stencils in a single manufacturing process, without the need for subsequent post-forming cutting or smoothing operations. Tecan has developed and refined its PEF techniques, in part from expertise gained over years in the production of traditional photo-etched stencils and from ongoing industry feedback and development initiatives with high-volume PCB producers, globally. PEF stencils are proving to be the fastest growing and most widely adopted manufacturing method for modern day, and next-generation, high-volume PCB production needs. Their adoption is said to engender shorter product cycle times, reduces manufacturing costs, eliminates secondary flux deposition and negates the need for subsequent hand or wave soldering. Source: PCBnewsline