Tamura Wins Advanced Packaging Award
Jul 27, 2005
Tamura H.A. System Inc. has announced that it has been awarded a coveted Advanced Packaging Award in the category of Reflow Equipment for its FLIP Solder Bath.
The crystal glass award was presented by Advanced Packaging Magazine's Editor-in-Chief Gail Flower to Peter Kim, Tamura Sales and Marketing Manager, during a Wednesday, July 13, 2005 ceremony that took place at the Regency Center in San Francisco, CA.
FLIP Solder Bath for Lead-free reflow soldering solutions features Linear Induction Pumping Technology in which three phases of AC currents flow through induction coils to induce horizontal magnetic fields inside solder bath. The magnetic fields generate vertical force, F, per Fleming's left hand law. The Force moves molten solder upward through nozzles and flow down by gravity. Two Induction coils generate magnetic field and propelling force as the alternating AC current flows in induction coils. Developed for use in both reflow and selective solder systems, the FLIP is one of its kind.
Additionally, the FLIP Solder Bath features numerous advantages over other solder bath systems, including less solder used: only 300 kg, instead of 450 kg and less solder dross: 7 kg, instead of 15 kg, after 8 hours of operation. This results in less waste to eliminate making this device not only environmentally efficient but also saves a significant time saver as well not having to stop the machine as often to empty the dross.
The patent-pending technology offers users multiple advantages, including the following: the solder bath uses 30 percent less initial solder to operate because it features a smaller solder bath than conventional systems; and the solder bath generates 40 percent less solder dross after eight hours of operation than conventional motor-driven solder baths.