UTAC strengthens sireless test capability with Teradyne FLEX for microwave test

Teradyne (NYSE:TER) announced that UTAC (United Test and Assembly Center Ltd.), a leading independent provider of total semiconductor test and assembly solutions, has taken delivery of multiple Teradyne® FLEX(TM) test systems with a full range of Teradyne Gen4 Microwave test capability. The systems cover testing for the full spectrum of RF devices from discrete RF ICs to RF System-on-a-Chip applications (RF SOC). The FLEX systems are testing devices for multiple customers at UTAC's Singapore and Shanghai production facilities, significantly strengthening the company's test offering and market reach. 
 
"The FLEX system and its Gen4 Microwave test capability enable us to address a wider range of highly-integrated applications for wireless products, including cellular transceivers, WLAN, Bluetooth and GPS," said CK Tan, UTAC's Group Vice President of Corporate Test and Development. "The rapid deployment of devices into production on our FLEX systems has already contributed to meeting critical production milestones for our customers."

"UTAC is a long-time Teradyne customer that has consistently valued test systems that enable its customers to confidently ramp their next-generation devices and achieve the lowest cost-of-test available," said David Trounson, General Manager, Teradyne Semiconductor Test Wireless Business Unit. "The FLEX architecture and Gen 4 Microwave capability will help UTAC meet the demanding test requirements of the latest wireless devices."