MICRO SYSTEM Technologies 2005

International Conference & Exhibition on Micro-Electro-Mechanical, Opto & Nano Systems, Munich, Germany, October 5-6, 2005

-- MICRO SYSTEM Technologies 2005: More than 70 oral and 20 poster presentations from international speakers
-- Four keynote speakers from the US and Europe

Conference and exhibition of MICRO SYSTEM Technologies 2005 will take place in Munich, Germany October 5-6, 2005. The event will present the latest in the development, production and application of microsystem technologies. Since 1990 the bi-annual event MICRO SYSTEM Technologies has drawn the top experts from leading international companies and research institutions. 46 per cent of the over 500 attendees at the last event in 2003 came from outside Germany.

The following keynote speeches will be given:
Wednesday 05 October 2005:
-- BioMEMS Packaging
Marc Madou, University of California, USA
-- Recent Accelerometer Technology Developments
Andreas Wild, Freescale Halbleiter Deutschland GmbH, Germany

Thursday 06. October 2005:
-- More than Moore
Fred von Roosmalen, Philips Semiconductors, NL
-- Synthesis and Reconfiguration Techniques for Digital Microfluidics-Based Biochips
Krishnendu Chakrabarty, Duke University, USA

Conference tracks with five to eleven speakers are scheduled along the following topics:
-- Advanced MEMS Processes and Technologies
-- MEMS and MST Packaging
-- Functional Integration and Devices
-- Materials and Material Characterization for Microdevices
-- Nano Structures and Devices
-- Assembly and Interconnect
-- System Integration, Packaging and Architecture
-- Reliability, Testing and Quality of Microsystems
-- Design and Simulation
-- Bio-/Chemical MEMS Devices and Concepts
-- Commercialization and Infrastructure
-- Products, Equipment and Services

Statement of the Conference Chair Prof. Dr. Herbert Reichl, Technical University and Fraunhofer IZM, Berlin

"Micro scale devices are today an indispensable part of many products, either high tech or consumer. Sensors and actuators are becoming integral to automotive, medical, telecom, photonic applications and even toys and throw-away products. Combining micro-devices and microelectronics (MICROSYSTEMS) in the form of heterosystem packages, new product visions can be realized at low cost and made available to all.

Miniaturized footprints allow these Microsystems to enter all areas of our everyday life and become indispensable assistants of the globally active individual to manage the professional and private life with optimum performance and comfort.

Packaging has been regarded often as a necessary -but non-value added- process. With Microsystems, packaging will bring in a paradigm shift. With sensors, generic MEMS devices and actuators combined with powerful electronics, a functional package will bring down the cost of the final system, increase its performance and provide an easy-to-use handling format. The full synergy of such a combination can only be achieved, if the packaging process becomes an integral part of the product design. Thus, this future level of hetero system integration will include new concepts, new materials, new processes, design suites, simulation tools and new technologies. Those are now under development and will guarantee, that the global community can benefit from existing and emerging Microsystem solutions."

Conference language of MICRO SYSTEM Technologies is English. The detailed conference program is available at www.mesago.de/mst or by contacting the organizer at phone ++49 711 61946-28 or e-mail mst@mesago.de. Early Bird discounts are valid until24 August 2005.