ECD begins shipments of AutoM.O.L.E. Xpert3
Jun 23, 2005
ECD has introduced painless profiling for perfect oven recipes with its latest version of AutoM.O.L.E.® Xpert software, Xpert3.
The Xpert3 kit works with the SuperM.O.L.E.® Gold thermal profiler to automate convection reflow oven process development. Xpert3 distills recipe development into three steps: 1. Create Signature; 2. Plan Target; & 3. Set & Verify.
The new Signature Wizard speeds you through the process of creating an oven signature file for your own reflow oven at a given convection rate. With that oven selection in place you Plan robust target profiles, choosing from amongst the 400 solder paste formulations in the Xpert3 database. Entering Assembly Properties information completes the planning stage and Set & Verify delivers the oven recipe.
"With Xpert3, you won't spend all day at the oven making iterative profile runs to develop a reflow recipe" says Scott Philips, ECD Vice President of Sales & Marketing. "Customers using this program now are re-qualifying assemblies to Lead-Free in 60% to 80% less time because the Planning is automatic, and just one profile pass is needed for verification."
There are many additional benefits to the Xpert 3 system. A solder paste specification may be set to your choice of Ramp-Soak-Spike or a Ramp-to-Spike profile. Converting an existing process to a new Lead-Free paste is as quick and easy as applying it from the Paste selector. Qualify your oven's Lead-Free capability by observing if the required zone setpoints per conveyor speed exceed the oven's maximum capability. The Transpose command immediately converts a profile to your new oven, and the system works with any reflow oven. Xpert3 simplifies the process engineer's job just when you need it most- to ease your Lead-Free conversion workload.
For more information, visit www.ecd.com