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Sanmina-SCI Corporation, a leading global electronics manufacturing services (EMS) company, and Tellabs today announced a multi-year outsourcing agreement. Under the terms of the agreement, all printed circuit board assembly (PCBA) and repair services for Tellabs North American products will be transferred to Sanmina-SCI facilities. No further terms of the transaction were disclosed.Commenting on the expanded contract manufacturing agreement, Jure Sola, Chairman and Chief Executive of Sanmina-SCI, said, “For more than 10 years we have been working closely with Tellabs providing this leading OEM with best-in-class circuit boards, backplanes and enclosures for their telephony distribution, digital cross connect, metro optical and transport switching product lines. This new agreement, which significantly expands our current relationship, will leverage our global scale and technology expertise to shorten the supply chain, accelerate product time to market, and reduce Tellabs’ manufacturing costs. In addition, transferring these operations to our current facilities will increase our manufacturing utilization rates and operating efficiencies. We look forward to continuing to provide this valued customer with superior products and services, and to future opportunities to further expand our alliance.”Source: Reuters