New BGA bumping solder paste from Indium
May 18, 2005
Indium Corporation has announced its new BP-3106 BGA Bumping Solder Paste, said to produce large deposits of solder material in bumping and other applications using only an SMT printer with a bumping stencil.
BP-3106 Bumping Solder Paste is applied using existing equipment, allowing the flexibility of increasing the throughput by increasing the BGA substrate panel size and printing speed without extra investment in expensive equipment, such as BGA ball placement hoppers.
BP-3106 Bumping Solder Paste has excellent release properties, robust slump resistance, and ultra-low voiding. It can be used for both area array and peripheral BGAs and passes SIR before and after cleaning.
Standard packaging includes 500g jars and 700g Semco cartridges. In addition, this paste can be applied using an enclosed printhead such as DEK's ProFlow and MPM rheo pump.
For more information on BP-3106 Bumping Solder Paste, visit Indium Corporation at www.indium.com or email email@example.com.