Accelonix introduces Datacon's Multi-Chip Die Bonder
May 20, 2005
Following its recent appointment by Datacon as its UK Distributor, the 2200 apm Multi-Chip Die Bonder developed specifically to meet the demands of the advanced packaging market is now available from Accelonix. The 2200 apm combines great flexibility with minimum space requirements (less than 1m2). Despite its compactness, the 2200 apm Die Bonder can execute flip chip and die attach tasks in just one module. Regardless of the target connection technology (flip chip, die attach, or a combination of both), conversions between different applications takes minimal time. The 2200 apm exhibits perfect handling of very small dice (from 0.17mm) as well as very large dice (up to 25mm, optionally up to 35mm). The 2200 apm achieves a placement accuracy of 10µm at 3s by virtue of its high precision linear drives for X, Y and Z axes and a separate servomotor for the theta axis in combination with automatic temperature-drift compensation.
The 2200 apm features include:
-- An Automatic Tool Changer System, that takes only 2 seconds
-- Automatic Wafer Handling System, that can handle up to 25 different wafers and takes less than 7 seconds to change wafers
-- Flip Chip Unit - 180o flip with an achievable placement accuracy up to +/- 10µm at 3Sigma, cmk: 1.33
-- Needle Ejector System, with five different needle kits (for single- and multi needles configurations)