IPC and Soldertec Global aid lead-free transition
May 26, 2005
With a little more than a year to go before the Restriction on Hazardous Substances (RoHS) Directive compliance deadline (July 1, 2006), the most important key to hassle-free compliance is to stay informed.
To help the industry prepare for lead free implementation, IPC and Soldertec Global, are sponsoring the 3rd International Conference on Lead Free Electronics, to take place June 7-10, 2005, in Barcelona, Spain. IPC and Soldertec Global will bring the industry's top experts together for a major European conference on this subject.
Critical lead free issues including new alloys and materials evaluations, inspection changes, tin whiskers, lead free on advanced packages like chip scale and flip chip, and reliability will be covered during the conference. Don't miss the opportunity to enhance your knowledge of RoHS compliance issues.
For additional information on the conference or to register, visit www.ipc.org/LFBarcelona.