Automated solder dispensing system from SolderPlus
Apr 27, 2005
The SolderPlus dispensing system is a cost-effective, easily implemented way to automate solder application in benchtop assembly processes.
This compact, one-stop solution integrates three EFD products - high-performance EFD SolderPlus solder paste, a precision dispense valve, and a new XYZ positioning platform.
SolderPlus paste is specially formulated for trouble-free dispensing without clogging or separating. Conveniently prepackaged in disposable syringes, it is available in a range of alloys and flux systems, including lead-free.
Solder Plus is applied with an EFD dispense valve mounted on the new Ultraa TT tabletop automation system, which combines precision dispensing controls and accurate positioning functions in one compact unit. Each system is configured by EFD's own application specialists to deliver a low-cost automation solution tailored to each customer's specific application requirements-without the risks and unknowns often associated with process integration.
For a demonstration or more information, please visit Stand H400 or contact EFD International at Tel. +44 (0) 1582 666334, Fax +44 (0) 1582 664227, UK Freefone 0800 585733 or firstname.lastname@example.org.