MVP announces wire bond inspection capabilities on Supra M AOI system
May 04, 2005
Machine Vision Products (MVP), a leader in vision and process control technology, has announced the successful addition of wire bond inspection to its newly introduced Supra M.
MVP is expanding its current capabilities to include the application of wire bond. "We are very excited to offer this new affordable option with our Supra M AOI System to the wire bond inspection by leveraging the same capabilities and tools offered by our standard MVP AOI software," states Dr. George Ayoub, President and CEO of MVP. "This will expand our product line beyond component assembly and paste inspection, enabling MVP to offer a competitive product for the packaging industry."
Defects such as wire trace conformity, bent wires, distance to adjacent wires, loop height, straightness tolerance, ball/wedge geometry, and contamination can easily be detected with the Supra M wire bond configuration.
The Supra M AOI system is modelled after the AutoInspector 1820 series, allowing advanced capabilities in a smaller footprint. With full solder joint inspection and measurement capabilities, the system comes standard with one large-format color digital camera, specialized illumination, and a high-precision linear x/y stage in a 960 x 965 mm footprint.