KIC announces lead-free, hands-on workshop
May 05, 2005
KIC announces it will co-sponsor a lead-free workshop to be held Wednesday, May 18 and Thursday, May 19, 2005, at the Henkel Technologies facility in Irvine, CA. The workshop is co-sponsored by Henkel Technologies, Engent, Speedline Technologies, Cogiscan and OK International.
The conversion from a leaded process to a lead-free process is not a simple transition. A solid understanding of the alloys, fluxes, board and component finishes, and how they impact the process will be required. Additionally, another critical aspect of converting to lead-free is the shrinking process window caused by the higher solder melting temperatures butting up against the temperature tolerances of the most sensitive components.
This comprehensive two-day, hands-on training program is designed for both engineers and engineering management, and will provide participants with a broader knowledge of lead-free materials interactions, and a greater understanding of the process including advantages and limitations. A sample lead-free board manufactured over the two-day course will be produced and taken away by each attendee. Additionally, engineering and technical representatives will be available for one-on-one discussion.
A Panel of Industry Experts will be present, and will discuss the following:
-- Dr. Neil Poole and Dr. Brian Toleno of Henkel Technologies will present on material interactions, surface mount adhesives, underfills, conformal coatings and alloy reliability.
-- Dr. Daniel Baldwin of Engent will discuss process engineering methods, analytical tools and design of experiment (DOE).
-- Francois Monette of Cogiscan Inc. will present on material logistics and identification, component compatibility, and the impact on moisture-sensitive devices (MSD).
-- Marybeth Allen of KIC will discuss management of the thermal processes as they relate to the conversion to lead-free manufacturing.
-- Grant Miller of OK International will present on rework with lead-free devices.
-- Keith Howell of Speedline Technologies will present on wave and reflow processes.
The workshop, designed for engineers and engineering management, will feature ample hands-on production floor training in the following areas:
-- Screen printing surface mount adhesives and solder paste, and placement
-- Reflow profiling
On May 18, registration will begin at 8 a.m., and sessions will convene from 8:45 a.m. until 5 p.m. On May 19, sessions will take place from 8 a.m. until 5 p.m. Henkel Technologies' facility is located at 15350 Barranca Pkwy, Irvine, CA 92618. Cost is $495 USD per attendee.
A detailed agenda, as well as additional information is available at www.kicthermal.com/index.html. Reservations must be made by May 13, 2005.