Kester introduces 959T liquid flux for lead-free applications
May 09, 2005
Kester has announced 959T, a new alcohol-based, no-clean liquid flux for lead-free wave soldering applications. Although Kester 959T works exceptionally well with lead-free processes, it is also backward compatible with tin/lead wave soldering operations.
Kester 959T offers users numerous benefits, including optimized wetting properties and the shiniest solder joints of any no-clean, solvent-based chemistry. With a typical solids content of 2.9%, the flux leaves evenly distributed residues for the ideal cosmetic appearance. The material contains a small percentage of rosin (0.5 percent), which improves solderability, heat stability, and surface insulation resistance. Kester 959T was also designed to minimize the incidence of micro-solderballs.
Kester 959T can be applied to circuit boards by a spray, foam or dip process. This product is non-corrosive, halogen-free, Bellcore-compliant and classified ORL0 per J-STD-004. Additionally, Kester 959T flux residues are non-conductive and do not require removal in most applications.
Kester's Web site may be found at www.kester.com.