New probe solution from FormFactor
May 10, 2005
FormFactor, Inc. has announced delivery of its latest product for enabling breakthrough wafer test performance and throughput in the emerging System-on-Chip (SoC) flip chip market.
FormFactor, a leading provider of advanced wafer probe cards, introduced the FormFactor BladeRunner(TM)175 (BR175) Multi-DUT (Device Under Test) wafer probe card for flip chip logic, with DUT capabilities well in excess of any other product on the market.
FormFactor's latest solution is said to significantly increase semiconductor manufacturers' wafer test capacity and help to drastically reduce their total cost of test.
The FormFactor BR175 Multi-DUT wafer probe card is designed and manufactured to provide cost-effective testing functionality. The BR175 Multi-DUT card incorporates the Company's proprietary MicroForce(TM) probing technology and probe planarity technologies which enable the testing of area array flip chip bumps with significantly reduced probe force, in turn minimizing the risk of cracking fragile inter-layer dielectric materials. FormFactor's MicroForce probing technology has demonstrated superior product performance at customers' production facilities, minimizing the re-sort rate and improving wafer sort yield of semiconductor manufacturers.