Indium to exhibit advanced assembly materials at Semicon Singapore
Apr 13, 2005
Indium Corporation will feature advanced assembly materials for Semiconductor Packaging at Semicon Singapore. The exhibition, held on May 4-6, 2005, will be held at the Suntec International Convention & Exhibition Centre in Singapore.
Indium Corporation will feature semiconductor assembly materials including: No-Flow Underfills, Epoxy fluxes, Interconnect fluxes, and BGA Bumping Pastes. Experts will be readily available at the booth to answer questions on Semiconductor and Pb-Free assembly materials. In addition, technical papers, articles, and information on a full range of electronic assembly materials, including solder pastes, wave solder fluxes, rework materials, and solder fabrications, will also be available. Indium Corporation will be located on level 6, exhibit #1203.
The semiconductor market in Singapore is on the rise and spending on semiconductor materials in Singapore is forecasted to grow to over $1billion in 2005. Singapore is home to leading assembly and test manufacturing facilities and the Semicon event attracted just under 8000 visitors in 2004.
For more information about Semicon Singapore, visit www.semi.org/semiconsingapore or go to Indium's website at http://www.indium.com/corporate/tradeshows.php.