KIC to present at NEPCON China/EMT China 2005

KIC has announced that it will present at the upcoming NEPCON China/EMT China 2005 trade show and exhibition, scheduled to take place April 12-15, 2005, at the Shanghai Everbright Convention and Exhibition Centre in Shanghai, PR China.

KIC's presentation, "Understanding the Impact of Accelerated Temperature Profiles on Lead-Free Soldering," will be given from 1:30 until 1:55 p.m. on April 11 during Session three, which is Lead-Free Component Attachment. The discussion will focus on accelerating production throughput and will be presented by Mr. Seet Keng Seng.

Professor John Evans at Auburn University/CAVE has lead a research project on behalf of KIC to study the effects that lead-free manufacturing will have on production line throughput. The industry concern has been that the reflow profiles for lead-free soldering typically require longer processing times due to elevated peak temperatures and flux activation times defined by solder paste suppliers. These profiles become particularly challenging when a wide variety of packaging types are integrated within a single circuit design.

The paper investigates these increased processing times that are required for high-volume manufacturing of lead-free electronics.

For more information on the upcoming convention and exhibition, visit NEPCON China's Web site at www.nepconchina.com.