KIC to co-host Lead-free RoHS assembly seminar in San Jose, CA
Mar 18, 2005
KIC announces that it will co-host a seminar titled, "Project 2005: Achieving Lead-free RoHS Assembly." The seminar will be held Thursday, April 7, 2005, at the Four Points Sheraton in Sunnyvale, CA, and will be hosted together with Kester and Metcal.
As the July 1, 2006 deadline for the European WEEE and RoHS directives approach, many products will be lead-free and also free of environmentally unfriendly chemicals specified for elimination in the RoHS document. In 2004, China also joined in with a similar RoHS plan, resulting in more RoHS-compliant products in the near future.
Transitioning to lead-free soldering and RoHS compliancy is much more than simply choosing a lead-free solder. There will be equipment compatibility issues to investigate, component and board procurement, and compatibility problems to address. There also will be lead-free process validation studies, lead-free product implementation plans to execute, and training for line supervisors and operators to be done.
KIC, Kester and Metcal have been working to prepare companies for this upcoming change. The companies' experience in soldering technology (both leaded and lead-free) can help industry companies become compliant with the RoHS directives. The Project 2005: Lead-free RoHS Assembly is designed specifically to assist companies in transitioning reliably without false starts. The series brings together the information that will save companies many engineering hours of research and will give what is needed to achieve lead-free and RoHS compliancy rapidly.
The seminar begins with a continental breakfast at 7:30 a.m. This will be the first of many networking opportunities. Six hours of presentation, ideas and discussion covering the below topics will follow: lead-free and RoHS directive overview; impact to a company's operations; impact of dual systems, leaded and lead-free; boards and RoHS requirements; components and RoHS requirements; lead-free soldering and alloy selection; surface finish changes and solderability; equipment changes and process modifications; optimizing the wave solder operation; BGA rework practices; hand soldering and rework production issues; preventing soldering defects with lead-free; contamination controls; training and documentation with lead-free; field service issues with lead-free; and finished assembly identification and traceability.
Lunch and refreshments will be provided. Additionally, experts will be available for questions and answers during all breaks. Attendees will receive a lead-free assembly technical manual containing presentations materials and detailed technical white papers; a subscription to the Lead-Free Connection(TM) Newsletter, provided quarterly; and valuable process information and technical tips to achieve solid lead-free processes.