Merix's Data Circuit Systems acquires Buried Capacitance license

Merix Corporation has announced that Data Circuit Systems, a Merix Company, has been granted a license as a manufacturer of Products using the Buried Capacitance technology from HSCI. 

This includes conventional 2 mil glass reinforced epoxy laminate style ZBC®, as well as next generation FaradFlex, which is a thin polymer film based Buried CapacitanceTM material, manufactured by Oak-Mitsui Technologies.
 
Steve Robinson, President Merix San Jose, stated, "Having the Buried Capacitance license will allow us to further serve the needs of many of our customers who require these advanced capacitive materials for their high-speed designs. This opens additional opportunities for us in the marketplace."
 
With this additional site license all Merix facilities are Buried Capacitance licensed, Dan Olson, Senior VP Sales and Marketing noted, "With all of our manufacturing sites now licensed, we can continue to execute our strategy to offer quick-turn prototypes from San Jose through ramp and volume at Forest Grove and Wood Village, without limitation of the Buried Capacitance technology."