Universal adds new knowledge-based white papers to website
Mar 02, 2005
Universal Instruments has added seven new white papers to its global website, www.uic.com, and enhanced the site's dedicated white paper section with two new subject areas: Thermal Management and Medical Electronics.
The new white papers are:
-- Effects of Assembly Process Variables on Voiding at a Thermal Interface.
-- Quality and Reliability Considerations for the Assembly of Implantable Medical Electronics.
-- Low Force Placement Solutions for Delicate and Low IO Flip Chip Assemblies.
-- Fragility of Pb-Free Solder Joints.
-- Lead-free and Tin-Lead Assembly and Reliability of Fine Pitch Wafer Level CSPs.
-- Study of Alternate Surface Finishes of Quad Flat Packs.
-- Assembly and Reliability Issues Associated with Leadless Chip Scale Packages.
Universal's website has a dedicated section incorporating almost 60 different industry white papers, covering topics ranging from 0201 Assembly, Optoelectronics, Adhesive and Dispensing, to No-Lead Soldering. Many of them have been presented at industry conferences and events.
As the industry leader, Universal is committed to supporting the electronics manufacturing industry by sharing the knowledge gained from the projects we undertake at our globally-respected SMT laboratories. Our white papers are based on
the research and development work done at our SMT Laboratory in Binghamton, USA and Technology Excellence Center in Suzhou, China, which focuses on optimizing current manufacturing processes, and identifying and advancing the new and emerging technologies that will take electronic assembly far into the future.
Activities undertaken in Universal's SMT laboratories include: prototyping, root cause failure analysis, inspection, process audits and support, knowledge transfer and training, and product development and design. We have invested in state-of-the-art assembly and analytical equipment, and the labs are staffed by technical experts, scientists and academic researchers.