DDi Corp. appoints Bradley Tesch as new COO
Mar 07, 2005
DDi Corp. (Nasdaq: DDIC) announced the appointment of Brad Tesch as the Company's new chief operations officer, effective March 11, 2005. Mr. Tesch replaces Michael Moisan who was responsible for DDi Corp.'s printed circuit board manufacturing operations since 2002 and has notified us of his resignation, effective March 11, 2005. Mr. Tesch has been with DDi Corp. since 2001 and will report to Bruce D. McMaster, DDi Corp.'s president and chief executive officer.
As chief operations officer, Mr. Tesch's duties include the day-to-day oversight of DDi Corp.'s North American printed circuit board (PCB) manufacturing and assembly operations with a focus on high-quality, on-time delivery of the Company's products and services. In this role, Mr. Tesch is accountable for DDi Corp.'s operating profitability, maintaining and implementing efficient manufacturing processes, allocating workflow among DDi Corp.'s nationwide manufacturing operations and supporting technological development and innovation. Following this change, the Company's chief financial officer, chief technology officer, chief information officer and Sales function will continue to report to Mr. McMaster.
Mr. McMaster commented, "Brad is a seasoned executive who we expect will lead and enhance the day-to-day operations of the Company. He is technically astute and has demonstrated a strong track-record in generating revenue growth resulting in increased margins and improved financial results of high- technology companies. Brad has more than 20 years of leading-edge PCB and related assembly experience and thoroughly understands all aspects of our business. Most importantly, Brad brings strong financial discipline to this position and will play a leading role in our top priority of returning DDi to profitability."
McMaster continued, "I want to thank Michael Moisan for service to DDi and wish him well in his future personal and professional endeavors."
Prior to his appointment as chief operations officer, Mr. Tesch was a Vice President Value-Add for DDi Corp.'s Silicon Valley subsidiary, a position he held since 2001. In this role, he was responsible for the entire workings of the assembly organization, including sales growth, manufacturing operations and full profit/loss responsibilities. From 1990 to 2001, Mr. Tesch held positions of increasing responsibility with Hi Tech Manufacturing, a start-up EMS provider in the early stages of the industry where he was responsible for all aspects of manufacturing, engineering and material procurement. During his tenure at Hi Tech Manufacturing, annual revenues grew to $160 million. From 1985 through 1990, he worked for AT&T Manufacturing and served as a manufacturing process engineer focusing on the introduction of high-speed SMT placement equipment. In this position, his focus was on technology advancement with cost containment and forward looking cost reductions as the business drivers. Mr. Tesch began his career as a member of the technical staff with Bell Telephone Laboratories in 1980. Mr. Tesch received an AASME degree from Western Iowa Tech.