Dielectric Solutions introduced new technology at ECWC
Mar 08, 2005
Innovative products open up new PCB design opportunities
Dielectric Solutions, LLC announced the introduction of several innovative products at the Spring 2005 Electronic Circuit World Convention (ECWC) and IPC Expo in Anaheim, CA. The new products, all based on Dielectric Solutions' patented GlasFab® Process, were introduced to the printed circuit board industry for use in high performance multilayer circuitry, high speed digital applications and PTFE circuits for wireless and microwave applications. "After a significant investment in an entirely new technology platform, we are very pleased to offer to the electronics industry what many consider to be a breakthrough in glass fabric reinforcement," said John J. Kuhn, Vice President and Chief Technical Officer. "These new products give circuit designers what they have longed for - superior electrical properties combined with a flatter, thinner, smoother glass surface - that will improve dimensional stability, laser drilling performance, circuit reliability and allow for further circuit miniaturization."
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