Enthone introduces oxide replacement system
Feb 17, 2005
Enthone Inc. has introduced its AlphaPREP PC-7030 high performance oxide replacement system.
This next generation system claims to produce a highly bondable brown conversion coating on copper innerlayers using horizontal equipment by removing minimal amounts of copper.
Specially formulated for low-etch / high capacity operations, AlphaPREP PC 7030 offers up to 60 percent reduction in consumption and waste treatment, providing both ecological and economical advantages. Featuring a low copper etch factor of 0.9 â€“ 1.1u, copper loss from fine lines and thin copper is reduced, thus improving performance on controlled impedance. The end result is a reduced cycle time, increases in output and yields and a 40 percent increase in productivity after converting from a competitive process.
"AlphaPREP technologies have led the revolution in the global PWB fabrication market since first being introduced in 1997," said Axel Dombert, Enthone Global Product Line Manager, Process Chemistry. "AlphaPREP continues to be the oxide replacement system by which all others are benchmarked. AlphaPREP PC-7030 is the most recent advancement to the world's most widely used oxide replacement technology."
A fact sheet explaining the features and benefits of the AlphaPREP PC-7030 system is available. nterested parties should contact email@example.com.