Tyco Electronics takes APS 1-H Hybrid Module Assembly System to APEX
Feb 23, 2005
Tyco Electronics has showcased the versatile hybrid module assembly system - APS 1-H - at the APEX tradeshow and exhibition.
The APS 1-H combines a solid foundation and advanced technology to handle complex hybrid assembly at high throughput rates. Additionally, the system features a rigid frame with a servo-driven, linear motor positioning system. A closed-loop feedback system with linear scale encoders continually monitors the exact location of the dual-spindle placement head and ensures outstanding repeatability. This solid foundation enables the APS 1-H to attain Â±0.0005" (0.012 mm) 3-sigma placement repeatability.
The APS 1-H is also said to meet hybrid module production challenges with highly repeatable performance and configuration flexibility. To complement its accuracy, the hybrid module assembly system supports a variety of die presentation formats, including wafer, GEL-PACK, Surftape and waffle packs. The APS 1-H features a large, flexible tabletop that accept up to 108 2" waffle packs or a custom configuration to meet unique application requirements.
The APS 1-H offers numerous features and benefits, including the following: Assembles advanced packages, hybrid circuits and microelectronic modules; provides Â±0.005" (0.012 mm) 3-sigma placement repeatability; processes die as small as 0.008" (0.2 mm); reconfigures easily to meet changing production needs; and handles substrates from 1.0 to 19.3" (25 to 490 mm) wide.