Sanmina-SCI to showcase PCB and backplane technologies at APEX
Feb 22, 2005
Sanmina-SCI Corporation (Nasdaq: SANM) will exhibit new printed circuit board (PCB) and backplane technology development at the APEX, IPC Printed Circuits Expo and IPC Designers Council Summit in Anaheim, California, February 22-24, at the Anaheim Convention Center. Sanmina-SCI will be located at booth number 2442.
"We are excited to participate at APEX and showcase new PCB and backplane technologies, plus demonstrate the latest developments in High-Performance Laminates, Embedded Passives, Microvias and HDI, Signal Integrity, Buried Capacitance(R) and RoHS/Lead-free Compliance," said George Dudnikov, Senior Vice President and Chief Technical Officer for Sanmina-SCI's PCB and Backplane Divisions. "We are also looking forward to demonstrating our ATCA-compliant 14-slot, full-mesh backplane and rack assembly running at 10 Gbps bandwidth and 10E-15 BER."
Several other exhibitors will demonstrate Sanmina-SCI's PCBs and backplanes operating in their products. These products will also be displayed at the Sanmina-SCI booth.