Siemens unveils its new Siplace X-Series
Feb 23, 2005
The Electronics Assembly Systems Division of Siemens Logistics and Assembly Systems, Inc. (EA) unveiled its new Siplace X-Series representing maximum speed with extreme precision at APEX today.
One of the X-series' major advancements is the newly developed 20-segment Collect&Place head, four of which can be installed on the four-gantry machine configuration for a placement performance of 80,000 components per hour with an accuracy of 55Âµm at 4 sigma. The head is equipped with 20 nozzles, features highly advanced direct-drive technology, is robust and requires minimal maintenance. As a result of its integrated component sensor and new vision system, this product family produces not only more speed and accuracy, but increases placement quality as well.
The modularity of the new Siplace series allows customers to configure exactly the amount of capacity they need with two, three or four gantries. For the kind of high-speed applications required in mobile phone production, for example, the X-series machine with four gantries, each equipped with one of the newly developed 20-segment Collect&Place heads, would be the ideal solution. Each head can achieve a placement rate of up to 20,000 cph with an accuracy of 55 Âµm at 4 sigma for a total of up to 80,000 cph on a single machine.
The 20-nozzle Collect&Place head handles 90 percent of the components in modern electronics manufacturing, particularly in high-speed environments. They can place components ranging from 01005s to components 6 x 6 mm large. In addition to the new 20-nozzle high-speed head, the proven 6-nozzle and 12-nozzle heads and the Twin Pick&Place head for super-precise IC placement are available for the X-series. By combining a 20-nozzle-Collect&Place head with a Twin Head, the new Siplace covers the complete component spectrum from 0201 (01005) to 85 x 85 mm or 125 x 10 mm including all odd-shaped components. Thanks to the machines' modular design, the user can select from four different placement head versions, which makes it possible to provide for virtually any requirement.
Component sensor directly at the pickup
Another highlight of the 20-nozzle Collect&Place head is the integrated component sensor mounted directly at the head's pickup and placement position. It works similar to a light barrier and checks the nozzle after each pickup and drop-off operation. Immediately before each placement, it makes sure that a component is attached to the nozzle. Conversely, it confirms immediately after the placement operation that the component is gone. This system prevents errors and guarantees a high level of placement quality. Especially with the smallest components like 0201s, the component sensor proves to be highly safe and reliable.
Direct drives on linear and rotating axes
By selecting state-of-the-art technology, Siplace developers set the foundation for high performance values of the 20-nozzle C&P head. The drives play a particularly important role. On linear as well as rotating axes, direct drives provide precision and speed. Each of the 20 segments to which the nozzles are attached operate independently from all the others and is rotated directly. Because of the unique head design, the rotation speed can be relatively slow enabling Siplace to combine maximum placement performance with high accuracy.
For additional information about the new Siplace X-Series, visit our website at www.siplace.com