SMTA Technology Summit announced
Feb 09, 2005
The SMTA has announced plans for a conference in Shanghai on Sunday and Monday, April 10-11. This program will be held in conjunction with NEPCON China and will include a full-day conference featuring a Keynote Address by Dr. John Lau, Agilent Technologies, on "Impacts of RoHS on Electronics Packaging and SMT Assembly".
Additionally, four paper sessions will focus on Lead-free Implementation, Process Optimization, Component Attachment, and Inspection, and the day will conclude with presentations on "Green Electronics Manufacturing in Southern China" by K.B. Chan, Ph.D., SMT Corporation, and "The Transition to Lead-free Production: From iNEMI Roadmap to Production" by Ning-Ching Lee, Ph.D., Indium Corporation on behalf of NEMI.
Also, on the day preceding the program, Dr. Lau will present a full-day course on "Design, Materials, Process, and Reliability of Lead-free SMT Packaging and Assembly".
If your company has an interest in being a conference sponsor or exhibiting at NEPCON China, or for any other questions, contact SMTA administrator JoAnn Stromberg: firstname.lastname@example.org or 952-920-7682.