Rogers to showcase products at DesignCon West 2005
Jan 27, 2005
Rogers will be featuring its RO4000┬« Series High Frequency Circuit Materials, R/flex CRYSTAL┬« polyimide laminates, two new lines of 2L-FCCL adhesiveless, all-polyimide (API) flexible circuit materials, and R/flex┬« 8080 Liquid Photoimageable Covercoat at this year's DesignCon West on booth no. 604.
RO4000┬« Series High Frequency Circuit Material is a glass-reinforced hydrocarbon/ceramic thermoset laminate system designed for performance sensitive, high volume commercial applications. These laminates and prepregs are designed to offer superior high frequency performance and low cost circuit fabrication. The result is a low loss material, which can be fabricated using standard epoxy/glass (FR4) processes.
R/flex CRYSTAL┬« flexible circuit materials with a transparent epoxy-based adhesive system are said to lead the industry in performance for cellular phone handset hinge flex, while offering the versatility for a diverse range of applications such as lap top computers and other hand-held electronic equipment.
R/flex┬« 8080 Liquid Photoimageable Covercoats help achieve the ultra-fine patterns needed for today's high density flexible printed circuits.
2L-FCCL Adhesiveless, All-polyimide (API) Flexible Circuit Materials are designed for use in cell phone hinge flex, LCD interconnection, and other applications. Both are available in rolls 250mm and 500mm (9.84 inches and 19.68 inches) wide. The new adhesiveless products are polyimide-based, made by directly bonding polyimide onto adhesion-treated copper foil, without the use of conventional adhesives.