Indium Corporation to exhibit at IPC/APEX
Jan 07, 2005
Indium Corporation of America will be exhibiting at IPC Printed Circuits Expo, APEX, the Designers Summit in Anaheim, CA on February 22-24, 2005.
Indium's exhibit will feature advanced technologies in Pb-Free electronic assembly with cutting edge materials. Their offering will span a full range of PCB assembly materials, including solder paste, wave solder fluxes, rework materials and solder fabrications, such as solder preforms, solder ribbon and wire, and solder spheres.
Indium will be exhibiting at booth #635. Experts will be readily available at the booth to answer questions on Pb-Free assembly, and articles and information will also be available.
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