European Institute of Printed Circuits (EIPC) Summer Conference 2005 announced and call for papers
Jan 10, 2005
EIPC announced that this year's summer conference will be in Stockholm, Sweden on June 9 and 10 and will include a table top exhibition on PCB Technologies, cost-reduction and innovation Call for papers - Topics to be included: - Lead free technology
What does the PCB manufacturer need to know to meet the needs of lead-free assembly processes in wave and re-flow soldering?
- Copper thickness requirements with lead-free PCBs
How to maintain constant copper thickness when multiple lead free solder processes are used? - Advanced laminate and prepreg as well as MassLam Technology
New electronic designs require new material solution. How will this impact the quality and performance as well as the cost of the PCB made in Europe. - InkJet technology in PCB fabrication
New InkJet technology will soon be part of the PCB fabrication processes. Where does the equipment companies stay and what is expected from the market for this new technology. Europe is the leader in this new technology. How will this impact the technology and the market?
- Environmental issues
The status of halogen free laminates in Europe. When do PCB fabricators have to change and what are the issues that assembly technology has to deal with?
- Small hole mechanical and laser drilling
What is expected for the next generation of electronic equipment made in Europe?
- New PCB technology and cost
What is imminent, will it help PCB fabricators to manage profitability?
- Micro via hole layer technology
The move to 0.5-mm (0.4 mm) pitch often requires two micro via hole layers per side of a PCB. Using new materials with compliance layer functionality will improve long term reliability. How can this be achieved?
- Rigid flex PCB technology introduced in rigid PCB fabrication processes
High added value PCBs are rigid flexible PCBs. Using the existing rigid PCB processes to manufacture rigid flexible PCBs is a real challenge. To conduct these processes, additional know how is needed to use laser scoring to process the breakaway parts of the PCB.
- Environmental testing and UL-Approvals for new type of PCBs
How better to understand the options and requirements for a fast UL qualification for new processes.
- Management items
How to manage and compensate for movements in the markets? For more details contact the EIPC: Mrs. Kirsten Smit-Westenberg - kwestenberg@eipc.org or visit www.eipc.org
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