Speedline Technologies experts to present technical papers, training programs and host informative seminars at APEX 2005

Speedline Technologies, Inc., will present several important technical papers and training programs as well as host a series of informative seminars at APEX 2005, February 22-24, 2005, in Anaheim, Calif.

Technical papers presentations showcase process leadership
"Speedline Technologies is honored to participate and share our technical expertise with our peers at APEX 2005," said Pierre de Villemejane, president, Speedline Technologies, Inc.  He said Speedline's presentations at the APEX technical conference would focus on three critical areas of PCB assembly - lead free assembly, reflow soldering, and solder past printing.  The presentations will reinforce Speedline's reputation as an innovator and industry process knowledge leader.

Speedline's technical paper titles and presenters are as follows:
--  "Affects of Cooling Slopes in Lead-Free Reflow," to be presented by Marc Apell, Product Marketing Manager; Tad Formella, Applications Engineer; and Rich Burke, Sales Engineer;
--  "Bridge Vision: An Analysis of Bridge Defects in the Solder Past Printing Process" to be presented by David Prince, Senior Engineer, Advanced Development;
--   "Practical Lead-Free Assembly," to be presented by Joe Belmonte, Senior Process Engineer, Advanced Process Group;
--  "Fluxing Effects In Lead-Free Wave Soldering" by Ken Kirby, Applications Engineer, and Keith Howell, Product Marketing Manager.

Additionally, Speedline will present the following training programs at APEX 2005:
--   "Practical Lead-Free Program", a full day training seminar, to be presented by Joe Belmonte, Senior Process Engineer and Marc Apell, Product Marketing Manager;
--  "Pin-In-Paste Process", a half-day training seminar, to be presented by Joe Belmonte, Senior Process Engineer.

As of February 28, 2005, abstracts and complete copies of the technical papers will be available for download from the Speedline website, at http://www.speedlinetech.com/apex2005abstracts.  Copies may also be requested by calling 1-508-541-4749 or e-mailing ecandela@speedlinetech.com.

In-booth seminars explore manufacturing challenges
Speedline will also host a series of free technical seminars focused on the leading SMT manufacturing process challenges of 2005.  The one-hour seminars will be hosted throughout APEX at the Speedline exhibit, booth number 1227.  Joe Belmonte, Project Manger, Advanced Process Group, will lead the events.  The schedule is as follows:
--  Tuesday, February 22
  --  12 p.m.:  Lead-free
  --  2 p.m.:  U.S. Competitiveness
  --  4 p.m.:  Defect-free Printing
--  Wednesday, February 23
  --  1 p.m.:  Lead-free
  --  3 p.m.:  U.S. Competitiveness
  --  5 p.m.:  Defect -free Printing
--  Thursday, February 24
  --  11 am:  Lead-free
  --  12 p.m.:  Defect-free Printing

Speedline to introduce groundbreaking new technology
In addition to presenting details of the latest industry innovations at APEX 2005, Speedline Technologies will make technology news at the show when it unveils its new MPM Accela™ printer.  The introduction will create a new paradigm in the way electronics manufacturers measure printer performance.  With two new U.S. patents and nine additional innovations patent-pending, the Accela introduces dramatic innovations in parallel processing technology that render traditional cycle time claims obsolete.  The Accela produces the most boards per hour of any industry printer, delivering raw throughput gains of more than 20% over the closest competitor, maximizes uptime and yields, and increases the return on capital investment, Speedline will feature the Accela in its booth, number 1227, throughout the show.