HKPCA & IPC Show - December 8-10
Nov 19, 2004
Effective platform for business matching opportunity!
The 2004 International Printed Circuit and Electronics Assembly Fair (HKPCA & IPC Show) will be staged at Guangdong Modern International Exhibition Centre on 8-10 December, 2004. This Show, with its professional and international perspective, is a well-recognized trade fair in the printed circuit and electronic assembly industries in the Asia Pacific region. The 2003 show attracted 16,000 visitors and 250 exhibitors from all over the world. In total, there were 650 booths representing a 22% increase compared to the previous year.
The Pearl Delta is the hub of PCB and electronic assembly manufacturing. Therefore, 2004 HKPCA & IPC Show aims to explore the potential and role of printed circuit board and electronic assembly manufacturers among the world’s marketplace. Exhibitors will be able to meet customers and prospects face to face in this annual occasion.
Apart from the International Technical Conference with the theme of "Lead Free" which will be held on 8-10 December 2004, HKPCA & IPC invite you to join the On-Site Forum of the 2004 International Printed Circuit & Electronics Assembly Fair. This two-day forum includes speeches from industry experts aimed at the decision makers and technical sessions for professionals in the Electronics Assembly, Equipment and Materials industries.
Participating companies include Nihon Superior Co., Ltd., Agilent Technology, Rohm and Haas Electronics Materials Asia Ltd. and MacDermid HK Ltd. who will be sharing their expertise at the Fourm.
Decision makers, purchasing managers and technical professionals from the Electronics Assembly, Equipment and Materials industries will be able to find first-hand information and insights for helping them to discover unlimited potential business opportunities in the competitive economy.
Date & Time :
1300 - 1505 (8 December, 2004)
0945 - 1620 (9 December, 2004)
Venue : Hall C, GD Modern International Exhibition Center, Houjie, Donguan, China
Dec 8, 2004 (Wed)
Day 1 - Electronics Assembly
1300 : 1350 EA 1 - For Accelerated Implementation of Lead Free Wave Soldering
Mr. Daisuke Watanabe, International Marketing General Manager
Mr. Hisashi Komura, Sales Engineer
Nihon Superior Co., Ltd.
1415 : 1505 EA 2 - Mr. Robert Ling, Senior Consultant, Asia Pacific
Dec 9, 2004 (Thurs)
Day 2 - Materials / Equipment Session
0945 : 1035 M 1 - Liquid Photoresist Technology and Oxide Replacement Technology
Mr. Simon Lee, Imaging Business Manager Asia, Circuit Board Technologies, Rohm and Haas Electronics Materials Asia Ltd.
1100 : 1150 M 2 - Advanced ViaFilling (DC/PPR) Technology and FPC/RFPC Process Overview
Mr. Dennis Yee, Metallization Business Manager Asia, Circuit Board Technologies, Rohm and Haas Electronics Materials Asia Ltd.
1300 : 1350 E 1 - From 50 - 500 - A Case Study in Factors Influencing IST Reliability
Mr. Jim Watkowski, Managing Director Metallization, Mr. Mike Wook - Technical & Marketing Director (Asia), Mr. Gilbert Siu - Product Marketing Manager (Asia), MacDermid HK Ltd
1415 : 1505 E 2 - Enhancing the Tarnish Performance of Immersion Silver Finishes
Mr. Mike Wook - Technical & Marketing Director (Asia), Mr. Gilbert Siu - Product Marketing Manager (Asia), MacDermid HK Ltd
1530 : 1620 E 3 - Filling Blind Microvias to Improve Reliability
Mr. Jim Watkowski, Managing Director Metallization, Mr. Mike Wook - Technical & Marketing Director (Asia), Mr. Gilbert Siu - Product Marketing Manager (Asia), MacDermid HK Ltd.
* Free admission, and pre-registration is not required
Hong Kong & Overseas
Ms. Amy Lo
Tel: (852) 29601820.
Fax: (852) 29601830
Ms. Rosy Liu
Tel: (86-20) 37619099 ext. 802
Fax: (86-20) 37619011
more information at http://www.hkpca-ipc-show.org/2004/