Smart Sonic Ultrasonic Stencil Cleaners Assure PCB Integrity
Nov 05, 2004
Smart Sonic Corporation developed the original ultrasonic stencil cleaning process in 1989. During the development phase it was realized that the new ultrasonic process was revolutionary for cleaning stencils, but initial customers showed reservations about using the system for cleaning misprinted PCBs as the Mil Spec disallowed the use of ultrasonics for cleaning printed circuit boards.
As a result, Smart Sonic has designed its ultrasonic stencil cleaning process to clean at very low power density (watts/liter) as early research by GEC Marconi and the EMPF Laboratory indicated that lower power density equals higher safety.
Recent studies by GEC Marconi Ltd. and a report by William G. Kenyon indicate that ultrasonic power densities of 10 watts per liter or less are desirable for the safe cleaning of populated PCBs. Smart Sonic stencil cleaners have always been rated at 10 watts per liter or less yet are still guaranteed to clean any type of solder paste from any fine-pitch stencil.
Smart Sonic has been able to successfully clean all types of solder paste at low power densities due to the cleaning efficiency of its proprietary 440-R SMT Detergent and the mechanical efficiency of the ultrasonic transducers used in all Smart Sonic stencil cleaners.
The Smart Sonic Stencil Cleaning Process has been recognized for its achievements with two SMT Vision Awards, The Canadian High Technology Award and has been certified environmentally safe, user safe and effective by the California Environmental Protection Agency.
For more information visit www.smartsonic.com .